Abstract: The IC packaging process is a vital process in the IC manufacturing industry. The quality of the package directly affects the reliability and service life of the finished chip, which in turn limits the overall performance of the electronic product. In order to monitor and guarantee the package quality of the chip during the production process, it is essential to measure the package quality of the integrated circuit. This work starts with the process characteristics of the packaging process and proposes an automatic detection and calculation method for packaging flash based on image processing methods. The method realizes the quantitative measurement of package flash, which is of great significance for the quality closed-loop control of the integrated circuit packaging process.

Key words: Quality inspection, integrated circuit, integrated circuit quality inspection, IC plastic packaging process, batch process

摘要： 集成电路(Integrated Circuit, IC, 又称芯片)封装过程是集成电路制造业中关键生产过程，封装质量的优劣直接影响到成品芯片的可靠性和使用寿命，进而制约着电子产品的整体性能。为了在生产过程中监测并保证芯片的封装质量，对集成电路的封装质量的检测必不可少。从封装过程的工艺特性入手提出了一种基于图像处理手段的集成电路封装溢料的自动检测与计算方法，实现了封装溢料状况的定量测量。这一方法对于实现集成电路封装过程的质量闭环控制有着较大的意义。

关键词: 质量检测, 集成电路, 集成电路质量检测, 集成电路塑料封装过程, 批次过程